Light emitting diode assembly and liquid crystal display device including the same
AssigneeLG Display Co., Ltd.
InventorsRok-Hee Lee, Jae-Min Sim, Do-Man Kim
Life of this patent
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Abstract
A liquid crystal display device includes a liquid crystal panel; and a backlight unit disposed under the liquid crystal panel and including an LED assembly, wherein the LED assembly includes a frame portion, LED chips arranged in the frame portion in a line and spaced apart from each other, connecting portions each disposed between adjacent LED chips and connected to adjacent LED chips through wire bonding, and a sealing portion including a fluorescent substance and covering the LED chips and the connecting portions, and wherein the sealing portion changes light emitted from the LED chips into a linear light source.
Claims9
A liquid crystal display device, comprising:
- a liquid crystal panel;
- and
- a backlight unit disposed under the liquid crystal panel and including an LED assembly,
- wherein the LED assembly includes a frame portion, LED chips arranged in the frame portion in a line and spaced apart from each other, connecting portions each disposed between adjacent LED chips and connected to adjacent LED chips through wire bonding, and a sealing portion including a fluorescent substance and covering the LED chips and the connecting portions, each of the connecting portions including a first electrode layer and a second electrode layer formed on a rear surface and a front surface of a substrate, respectively,
- wherein the sealing portion changes light emitted from the LED chips into a linear light source,
- wherein the LED chips are connected to each other through the connecting portions in series, and
- wherein each of the connecting portions is island-shaped and has a dummy chip structure.
An LED assembly, comprising:
- a frame portion;
- LED chips arranged in the frame portion in a line and spaced apart from each other;
- connecting portions each disposed between adjacent LED chips and connected to adjacent LED chips through wire bonding, each of the connecting portions including a first electrode layer and a second electrode layer formed on a rear surface and a front surface of a substrate, respectively;
- and
- a sealing portion including a fluorescent substance and covering the LED chips and the connecting portions, wherein the sealing portion changes light emitted from the LED chips into a linear light source,
- wherein the LED chips are connected to each other through the connecting portions in series, and
- wherein each of the connecting portion is island-shaped and has a dummy chip structure.
Dependencies are inferred from the claim text.