Method of replacing an existing contact of a wafer probing assembly

A method of replacing an existing contact of a wafer probing assembly, the method comprising:

• separating an existing coupon from a support surface of the wafer probing assembly, wherein the existing coupon includes an existing elastomeric layer and an existing contact, wherein the support surface is defined by a dielectric support and a support conductor, wherein the existing coupon is detachably affixed to the support surface by an existing adhesive bond, and further wherein the separating includes breaking the existing adhesive bond;
• and
• detachably affixing a replacement coupon to the support surface of the wafer probing assembly with a replacement adhesive to form a replacement adhesive bond, wherein the replacement coupon includes a replacement elastomeric layer and a replacement contact, and further wherein the detachably affixing further includes establishing electrical communication between the replacement contact and the support conductor.