Heat sink with flat heat pipe
AssigneeUnigen, Inc.
InventorsDavid Thomsen, Simon Tam
Life of this patent
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Abstract
A heat sink apparatus is disclosed. The apparatus comprises a base unit for use with an electronic component operable to make contact with a heat generating source, wherein the heat generating source is affixed to a printed circuit board. It also comprises a top unit wherein the top unit of the heat sink is rotatively coupled to the base unit, and wherein a slot forms in between the top unit and the base unit when the top unit is coupled to the base unit. Finally it comprises a heat pipe, wherein the heat pipe is received through the slot and held tightly therein, and wherein the heat pipe is operable to dissipate heat transferred through the base unit away from the heat generating source.
Claims20
A heat sink apparatus, said apparatus comprising:
- a base unit for use with an electronic component operable to make contact with a heat generating source, wherein said heat generating source is affixed to a printed circuit board;
- a top unit wherein said top unit of said heat sink is rotatively coupled to said base unit, and wherein a slot forms in between said top unit and said base unit when said top unit is coupled to said base unit;
- and
- a heat pipe, wherein said heat pipe is received through said slot and held tightly therein, and wherein said heat pipe is operable to dissipate heat transferred through said base unit away from said heat generating source.
A method of assembling a heat dissipating device, said method comprising:
- providing a base unit of a heat sink for coupling to a heat generating source, wherein said heat generating source is affixed to a printed circuit board;
- removably coupling a top unit of said heat sink to said base unit, wherein a slot forms in between said top unit and said base unit in response to said coupling;
- and
- receiving a heat pipe through said slot, wherein said heat pipe is operable to dissipate heat transferred through said base unit away from said heat generating source and wherein said heat pipe is tightly held in said slot.
A heat dissipating system, comprising:
- a base unit of a heat sink operable to make contact with a heat generating source, wherein said heat generating source is part of an electronic device;
- a top unit of said heat sink, wherein said top unit of said heat sink is operable to be removably coupled to said base unit in a plurality of different orientations, and wherein a slot forms in between said top unit and said base unit when said top unit is coupled to said base unit in any of said plurality of different orientations;
- a heat pipe received through said slot, and wherein said heat pipe is operable to dissipate heat transferred through said base and top units away from said heat generating source;
- and
- a metal enclosure, wherein said electronic device, said heat sink and said heat generating source are housed within said metal enclosure, and wherein said heat pipe further is operable to dissipate heat from said heat generating source to said metal enclosure.
Dependencies are inferred from the claim text.