Backlight source and manufacturing method thereof

A backlight source, comprising a PCB as well as a plurality of LEDs installed on and electrically connected with the PCB;

• the PCB includes a base layer, a dielectric layer, a conductive layer and an insulating layer stacked successively from bottom to top;
• the PCB is closed at its top by the insulating layer;
• the PCB includes a light bar area for installation of the LED and a heat dissipating area for heat dissipation that are respectively arranged in planes perpendicular to each other;
• the conductive layer is divided into a first conductive area on the heat dissipating area and a second conductive area on the light bar area that are insulated from each other;
• wherein the conductive layer is provided with an open slot making the first conductive area and the second conductive area insulated from each other, with the open slot communicating at its bottom with the dielectric layer, and the bottom of the open slot is not communicated with the base layer;
• the light bar area and the heat dissipating area are arranged respectively in planes perpendicular to each other, wherein bending a semi-finished PCB along the open slot, making the light bar area and the heat dissipating area respectively in two planes perpendicular to each other.