Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution

An electrodeposition system comprising:

• a plating apparatus;
• and,
• a plating solution analysis and dosing apparatus comprising:
• a container comprising a membrane separating a first compartment and a second compartment, said first compartment containing a plating solution that circulates between said plating apparatus and said plating solution analysis and dosing apparatus and said second compartment containing an additional solution,
• said plating solution comprising a solvent and, dissolved in said solvent, a first metal and a second metal different from said first metal,
• said additional solution comprising said solvent and being devoid of said first metal and said second metal,
• a first electrode in said plating solution;
• a second electrode in said additional solution;
• a power source having a negative terminal and a positive terminal;
• a polarity-switching unit electrically connected to said negative terminal, said positive terminal, said first electrode, and said second electrode;
• and
• a controller operatively connected to said power source and said polarity-switching unit and controlling said power source and said polarity-switching unit so as to selectively cause any one of the following within said plating solution analysis and dosing apparatus:
• performance of a first metal plating process;
• performance of a first metal de-plating process;
• and establishment and maintenance of an equilibrium potential,
• said controller causing said power source to turn off in order to establish and maintain said equilibrium potential,
• said controller causing said polarity-switching unit to electrically connect said first electrode to said negative terminal and said second electrode to said positive terminal so as to form a first electric circuit and further causing said power source to turn on and supply a first operating current to said first electric circuit in order to perform said first metal plating process, said first operating current causing said first metal to plate on said first electrode such that a first concentration of said first metal in said plating solution is decreased and such that a second concentration of said second metal in said plating solution remains constant, and
• said controller causing said polarity-switching unit to electrically connect said first electrode to said positive terminal and said second electrode to said negative terminal so as to form a second electric circuit and further causing said power source to turn on and supply a second operating current to said second electric circuit in order to perform said first metal de-plating process, said second operating current causing said first metal to de-plate from said first electrode such that said first concentration of said first metal in said plating solution is increased.