High strength, high heat resistance electrodeposited copper foil and manufacturing method for same
AssigneeFurukawa Electric Co., Ltd.
InventorsTakeshi Ezura, Akitoshi Suzuki, Kensaku Shinozaki, Hirokazu Sasaki, Satoshi Yamazaki
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Abstract
Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C. Resolution Means: An electrodeposited copper alloy foil that includes a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, and a method of manufacturing same.
Claims28
An electrodeposited copper alloy foil comprising a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, wherein said metal that exists as an oxide in a solution at pH4 or less or said oxide of the metal is contained inside a copper matrix of said electrodeposited copper alloy.
An electrodeposited copper alloy foil comprising a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, having a chlorine content less than 10 ppm, wherein said metal that exists as an oxide in a solution at pH4 or less or said oxide of the metal is contained inside a copper matrix of said electrodeposited copper alloy.
An electrodeposited copper alloy foil comprising a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, having a chlorine content less than 1 ppm, wherein said metal that exists as an oxide in a solution at pH4 or less or said oxide of the metal is contained inside a copper matrix of said electrodeposited copper alloy.
An electrodeposited copper alloy foil comprising tungsten, the remainder being copper and unavoidable impurities, wherein said tungsten is contained inside a copper matrix of said electrodeposited copper alloy foil.
An electrodeposited copper alloy foil comprising tungsten in a range of 10 to 2000 ppm, the remainder being copper and unavoidable impurities, wherein said tungsten is contained inside a copper matrix of said electrodeposited copper alloy foil.
Dependencies are inferred from the claim text.