Conductive silicone materials and uses

A curable silicone composition comprising a blend of the following ingredients:

• a hydrocarbon vehicle at a concentration of from 1 to 15 weight percent based on weight of the curable silicone composition, wherein the hydrocarbon vehicle is characterized by a boiling point from 100 to 360 degrees Celsius;
• a curable organosiloxane composition at a concentration of from 8 to 16 weight percent based on weight of the curable silicone composition;
• Cu—Ag core-shell particles at a concentration of from 70 to 89 weight percent based on weight of the curable silicone composition;
• and
• a mechanical thixotropic filler that is carbon nanotubes;
• wherein the total concentration of silver is from 9 to 12 weight percent based on weight of the curable silicone composition;
• wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method;
• and
• wherein the curable silicone composition is characterized by a Thixotropic Index(η1/η10) of from 3 to 10.

A curable silicone composition comprising a blend of the following ingredients:

• an isoalkanes mixture comprising at least three of (C12-C16)isoalkanes and wherein the lowest boiling isoalkanes molecules have an initial boiling point of greater than 210 degrees Celsius and the highest boiling isoalkanes molecules have an end boiling point of less than 270 degrees Celsius and the hydrocarbon vehicle is at a concentration of from 4.5 to 12 weight percent based on weight of the curable silicone composition;
• a hydrosilylation-curable polydimethylsiloxane composition comprising at least one vinyl-functional polydimethylsiloxane compound having on average per molecule at least 1 vinyl moieties, at least one trimethylsiloxy-terminated dimethyl methylhydrogensilicon compound having on average per molecule at least 1.1 Si—H moieties, a microencapsulated platinum hydrosilylation catalyst, and bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane, and bis(alpha,omega-glycidoxyalkyl-D3 to D6 alkyl,hydrogencyclosiloxane;
• and wherein the vinyl-functional polydimethylsiloxane compound is from 70 to 75 weight percent, the trimethylsiloxy-terminated dimethyl methylhydrogensilicon compound is from 1 to 5 weight percent, the microencapsulated hydrosilylation catalyst is from 10 to 15 weight percent, the bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane is from 1 to 10 weight percent, and the bis(alpha,omega-glycidoxyalkyl-D3 to D6 alkyl,hydrogencyclosiloxane is from 0 to 7 weight percent, all of the curable polydimethylsiloxane composition;
• and wherein together the trimethylsiloxy-terminated dimethyl methylhydrogensilicon compound, microencapsulated hydrosilylation catalyst, and the bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane, and bis(alpha,omega-glycidoxyalkyl-D3 to D6 alkyl,hydrogencyclosiloxane are from 20 to 30 wt % of the curable organosiloxane composition;
• Cu—Ag core-shell particles are at a concentration of from 70 to 89 weight percent based on weight of the curable silicone composition;
• wherein the total concentration of silver is from 7.5 to 12.0 weight percent based on weight of the curable silicone composition;
• and
• carbon nanotubes at a concentration of from 0.50 to 1.2 weight percent based on weight of the curable silicone composition;
• and
• wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition is curable to a cured silicone material
• characterized by a concentration of the Cu—Ag core-shell particles of from 88.4 to 90.4 weight percent, a volume resistivity less than 0.00090 Ohm-centimeter measured according to Volume Resistivity Test Method, and a thermal conductivity of greater than or equal to 5 Watts per meter*Kelvin measured according to Thermal Properties Test Method.

A curable silicone composition comprising a blend of the following ingredients:

• a hydrocarbon vehicle at a concentration of from 1 to 15 weight percent based on weight of the curable silicone composition, wherein the hydrocarbon vehicle is characterized by a boiling point from 100 to 360 degrees Celsius;
• a curable organosiloxane composition at a concentration of from 8 to 16 weight percent based on weight of the curable silicone composition;
• Cu—Ag core-shell particles at a concentration of from 70 to 89 weight percent based on weight of the curable silicone composition;
• and
• a mechanical thixotropic filler that is carbon nanotubes;
• wherein the total concentration of silver is from 9 to 12 weight percent based on weight of the curable silicone composition;
• wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.00090 Ohm-centimeter measured according to Volume Resistivity Test Method and a thermal conductivity of greater than or equal to 9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method.