Shielded encapsulating structure and manufacturing method thereof

An encapsulating structure comprising:

• a substrate having a first surface, a second surface, and a recess, the second surface being a surface of the recess and being a distance below said first surface;
• a cover member arranged at a distance from and facing the first surface of the substrate;
• housing walls having top, bottom, internal, and external surfaces and extending between the first surface of the substrate and the cover member, wherein the substrate, the cover member, and the housing walls define a cavity;
• a first conductive pad arranged on the second surface, the conductive pad being configured to be electrically coupled to a conduction terminal and being laterally spaced from the housing walls and inside the cavity;
• an electrically conductive material within the cavity and on at least one of the internal surfaces of the housing walls and the cover member;
• and
• an electrically conductive structure within the cavity and extending along a sidewall of the recess and electrically coupled to the housing walls and the conductive pad and configured to electrically couple the cover member to the conduction terminal, the electrically conductive material being between the electrically conductive structure and the housing wall.

An encapsulating structure comprising:

• a substrate having a first surface, a second surface, and a recess, the second surface being a surface of the recess and being displaced a first distance from said first surface;
• a cover member arranged at a second distance from and facing the first surface of the substrate;
• housing walls having internal surfaces and extending between the first surface of the substrate and the cover member, wherein the substrate, the cover member, and the internal surfaces of the housing walls define a cavity;
• a first conductive pad arranged on the second surface, the conductive pad being configured to be electrically coupled to a conduction terminal and being laterally spaced from the housing walls and inside the cavity;
• an electrically conductive material within the cavity and on at least one of the internal surfaces of the housing walls and the cover member;
• and
• an electrically conductive structure within the cavity and extending along a sidewall of the recess and configured to electrically couple the cover member to the conduction terminal, the electrically conductive material being between the electrically conductive structure and the housing wall.