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US 9,428,024 B2Granted
Bump shock absorbing device
AssigneeHyundai Mobis Co., Ltd.
InventorJong Woo Park
Life of this patent
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Abstract
A bump shock absorbing device may include: a stopper member provided on a vehicle body and contacted and compressed against a chassis according to a bump of the vehicle body; and a magnetic force generation member including a pair of magnetic force generation members provided to face the chassis and the vehicle body, respectively, and generating a magnetic force to absorb shock caused by the bump of the vehicle body.
Claims9
A vehicle comprising:
- a vehicle body comprising a first electromagnet device and a first surface;
- a chassis comprising a second electromagnet device and a second surface opposing the first surface;
- a compressible damper arranged between the first and second electromagnet devices such that, while driving the vehicle, the first surface of the vehicle body and the second surface of the chassis move toward each other without compressing the compressible damper, and then the first and second surfaces further move toward each other to compress the compressible damper;
- and
- at least one controller configured to selectively apply electric power between the first and second electromagnet devices based on a distance between the first and second surfaces, wherein the at least one controller is configured such that the electric power is applied to move the first and second electromagnet devices away from each other when the compressible damper is being compressed and also when the distance between the first and second surfaces reaches a predetermined value.
2 more elements
Dependencies are inferred from the claim text.