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AssigneeAsm Technology Singapore Pte Ltd
InventorsJian Xiong Su, Teng Hock Kuah, Shu Chuen Ho, Jiapei Ding, Ravindra Raghavendra
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Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
A molding press for encapsulating semiconductor dies on a substrate, the molding press comprising:
A platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising:
A molding press for encapsulating semiconductor dies on a substrate, the molding press comprising:
Dependencies are inferred from the claim text.