Gas injector and cover plate assembly for semiconductor equipment

A gas injector and cover plate assembly, comprising:

• a cover plate comprising a plurality of cooling fluid channels for introducing a plurality of cooling fluids with different temperatures to form a temperature gradient;
• a gas injector attached to the cover plate comprising:
• a gas distributor uniformly distributing a plurality of gases and a cooling fluid, the gas distributor comprising a gas conduit through the gas distributor for introducing a first gas;
• a fluid-cooling gas transmitter connecting the gas distributor comprising:
• a plurality of independent channels for introducing the cooling fluids to form a plurality of cooling fluid walls;
• a first gas channel connecting the gas conduit;
• and
• a plurality of gas channels for introducing the gases;
• wherein the independent channels being between the two adjacent gas channels, and outside the gas channels;
• and
• a plurality of gas spraying plates and a conducting cone being sequentially located beneath the fluid-cooling gas transmitter, the two adjacent gas spraying plates changing a flow direction of one of the gases, and the gas spraying plate and the conducting cone changing a flow direction of the first gas, wherein the gas spraying plates comprise three gas spraying plates with an inverted cone shape having a disc circular edge, three gas spraying plates with an inverted bowl shape having a curvature, or three gas spraying plates with a hollow center and a gradually increased thickness from the center to the circumference;
• and
• a ceiling attached to a surface of the cover plate and adjacent one side of the gas injector.