Welding method for substrate and membrane of membrane mobile polymer microfluidic chip
AssigneeBeijing Bohui Innovation Technology Co., Ltd.
InventorQi Yang
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Abstract
The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform.
Claims19
A method for welding a substrate and a membrane of a membrane mobile polymer microfluidic chip, comprising:
- fixing the substrate;
- applying, by a fixed tensing apparatus, a pulling force to the membrane;
- covering a surface of the substrate with the membrane;
- pressing the membrane against the surface of the substrate by applying a pressure;
- irradiating, by a laser from a laser source, a welding area on the substrate through the membrane;
- fusing, by the laser, the substrate and the membrane on the welding area;
- wherein the value of the pulling force is adjusted according to elastic parameters of the membrane and the value of the pressure.
A method to weld a membrane to a substrate of a microfluidic chip, the method comprising:
- covering a surface of the substrate with the membrane;
- applying, with a tensing apparatus, a pulling force on sides of the membrane to tense the membrane covering the surface of the substrate;
- applying air pressure onto a surface of the membrane in order to press the membrane against the surface of the substrate;
- adjusting a value of the pulling force of the tensing apparatus based on a value of the air pressure applied onto the surface of the membrane;
- placing, over the membrane, a mask with a transparent area where a laser irradiates the membrane;
- and
- irradiating, with the laser and through the transparent area, the membrane in order to fuse the membrane to the substrate of the microfluidic chip.
Dependencies are inferred from the claim text.