Systems for assembling electronic devices with internal moisture-resistant coatings
AssigneeHZO, Inc.
InventorsBlake Stevens, Max Sorenson, Marc Chason
Life of this patent
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Abstract
A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.
Claims18
A system for assembling electronic devices, comprising:
- a surface mount technology (SMT) element in which at least one surface mount device (SMD) is assembled with a circuit board to form an electronic device under assembly;
- an assembly element in which electronic parts, user interface components, and housing components are assembled with the electronic device under assembly;
- a first coating element in which a first moisture-resistant coating is applied to a first portion of the electronic device under assembly;
- and
- a second coating element, separate from said first coating element, in which a second moisture-resistant coating is applied to a second portion of the electronic device under assembly, the second portion being different from the first portion.
Dependencies are inferred from the claim text.