Method for manufacturing circuit board, circuit board, and electronic device

A circuit board comprising:

• a substrate;
• at least two function modules;
• a shielding frame, wherein the at least two function modules and the shielding frame are attached to the substrate, the shielding frame is located between the at least two function modules, and the shielding frame does not overlie either of the at least two function modules;
• wherein two sides of the shielding frame and the at least two function modules are coated with a plastic package material;
• wherein a top surface of the shielding frame and an outer surface of the plastic package material are covered with a conducting material;
• and
• wherein an outer surface of the conducting material is covered with an insulation material.

An electronic device, comprising:

• a circuit board comprising,
• a substrate;
• at least two function modules;
• a shielding frame, wherein the at least two function modules and the shielding frame are attached to the substrate, the shielding frame is located between the at least two function modules, and the shielding frame does not overlie either of the at least two function modules;
• wherein two sides of the shielding frame and the at least two function modules are coated with a plastic package material;
• wherein a top surface of the shielding frame and an outer surface of the plastic package material are covered with a conducting material;
• and
• wherein an outer surface of the conducting material is covered with an insulation material.