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US 9,426,930 B2Granted
Dissipating heat within housings for electrical components
AssigneeHewlett-Packard Development Company, L.P.
InventorLee Warren Atkinson
Life of this patent
Estimating the term…
Abstract
Embodiments of various electrical housings, particularly display housings, are provided. In this regard, a representative housing, among others, includes one or more electrical components that are disposed at the housing; a thermal attachment that is designed to transfer heat generated by the one or more electrical components; and a rear enclosure that is designed to engage the thermal attachment. The rear enclosure is further designed to dissipate the heat received from the thermal attachment.
Claims20
An electronic device comprising:
- a housing;
- one or more electrical components that are disposed in the housing;
- a thermal attachment that is designed to transfer heat generated by the one or more electrical components,
- wherein the housing is configured to engage the thermal attachment so as to receive and dissipate heat received from the thermal attachment and wherein the housing and the thermal attachment are configured to cooperate so as to steer heat at a greater heat flow rate away from the electrical components towards corners of the housing as compared to a heat flow rate at which heat is steered to other portions of the housing.
1 more element
An electronic device comprising:
- a housing;
- one or more electrical components that are disposed in the housing;
- a thermal attachment that is designed to transfer heat generated by the one or more electrical components,
- wherein the housing is configured to engage the thermal attachment so as to receive and dissipate heat received from the thermal attachment, wherein the thermal attachment comprises a pattern of perforations such that the thermal attachment disproportionately steers heat to predetermined portions of the housing.
1 more element
A method comprising:
- thermally contacting electronic components within a housing with a thermal attachment such that the thermal attachment receives heat from the electronic components;
- steering heat received from the electronic components towards corners of the housing such that a heat flow rate of the heat being steered towards the corners of the housing is greater than a heat flow rate of the heat being steered towards portions of the housing other than the corners of the housing;
- and
- conducting heat from the thermal attachment to the housing to dissipate heat through the housing.
1 more element
Dependencies are inferred from the claim text.