Film insert molding for device manufacture
AssigneeIntel Corporation
InventorsPeter Davison, David Pidwerbecki
Life of this patent
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Abstract
Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.
Claims9
A method of constructing a device comprising:
- forming a film into a shape that defines an interior region;
- disposing an electronic component within the interior region of the film;
- incorporating an additive into a thermo-set resin, wherein the additive is configured to absorb, store and distribute heat generated by the electronic component during operation of the device, and wherein the resin includes a castable material;
- substantially filling the interior region of the film with the thermo-set resin, wherein the thermo-set resin encompasses the electronic component;
- and
- hardening the thermo-set resin.
Dependencies are inferred from the claim text.