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US 9,426,901 B2Granted
Patterning method for component boards
AssigneeGeneral Electric Company
InventorsJohn Andrew Trelford, William Lonzo Woods, Jr., Thang Dahn Truong
Life of this patent
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Abstract
A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.
Claims10
A method of printing solder paste in a component board, the method comprising:
- using a first stencil having a first thickness to pattern solder paste into at least one through hole in the component board, the first stencil defining at least one first aperture;
- and
- using a second stencil subsequent to using said first stencil to print solder paste for at least one surface mounted part on the component board, said second stencil separate from the first stencil and having a second thickness less than or equal to the first thickness, the second stencil defining at least one surface mount aperture and at least one second aperture, the at least one second aperture being concentric with the at least one through hole and having a diameter greater than a diameter of the at least one through hole;
- wherein using the first stencil includes placing the first stencil on a surface of the component board and printing solder paste through the at least one first aperture, and wherein using the second stencil includes placing the second stencil on the surface of the component board and printing solder paste through the at least one surface mount aperture and through the at least one second aperture.
1 more element
Dependencies are inferred from the claim text.