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US 9,426,898 B2Granted
Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
AssigneeKulicke and Soffa Industries, Inc.
InventorsGuy Frick, Thomas J. Colosimo, Jr., Horst Clauberg
Life of this patent
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Abstract
A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.
Claims19
A thermocompression bonder comprising:
- a bonding station of the thermocompression bonder, the bonding station including (a) a support structure of the bonding station for supporting a substrate during bonding of a semiconductor element to the substrate, and (b) a bond head including a heated bonding tool for bonding the semiconductor element to the substrate;
- a fluxing station of the thermocompression bonder, the fluxing station including (a) a movable flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate by the heated bonding tool, (b) a support structure of the fluxing station for supporting the substrate during application of the flux material by the flux application tool;
- and
- a material handling system for moving the substrate from the fluxing station to the bonding station.
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A method of operating a thermocompression bonding machine, the method comprising the steps of:
- (a) applying a flux material to conductive structures on a substrate using a movable flux application tool of a fluxing station of the thermocompression bonding machine;
- (b) moving the substrate from the fluxing station to a bonding station of the thermocompression bonding machine;
- and
- (c) bonding conductive structures of a semiconductor element to conductive structures of the substrate after steps (a) and (b) using a heated bonding tool of the bonding station.
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Dependencies are inferred from the claim text.