Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

A method for producing a bonded structure, comprising:

• arranging a substrate containing an electrode, an electronic part containing stud bumps, and an insulating resin film so that the electrode of the substrate and the stud bumps of the electronic parts are faced each other via the insulating resin film, and heating and pressing the substrate and the electronic part to thereby bond the substrate and the electronic part together,
• wherein the insulating resin film contains:
• a first adhesive layer;
• and
• a second adhesive layer,
• wherein the insulating resin film is configured to bond the substrate and the electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part,
• wherein the first adhesive layer and the second adhesive layer each contain inorganic filler,
• wherein the second adhesive layer has a differential scanning calorimetry (DSC) exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer,
• wherein the first adhesive layer has a thickness that is 50% to 90% of a total thickness of the insulating resin film,
• wherein the first adhesive layer contains an epoxy resin and the second adhesive layer contains an epoxy resin, wherein the epoxy resin in the first adhesive layer is different from the epoxy resin in the second adhesive layer;
• wherein the first adhesive layer contains an inorganic filler and the inorganic filler in the first adhesive layer is silica and the second adhesive layer contains an inorganic filler and the inorganic filler in the second adhesive layer is silica, and wherein the silica in the first adhesive layer is the same as the silica in the second adhesive layer;
• wherein the difference between the DSC exothermic peak temperature of the first adhesive layer and the DSC exothermic peak temperature of the second adhesive layer is 7° C. to 9.5° C., and
• wherein the DSC exothermic peak temperature of the first adhesive layer is 115.5° C. to 118° C.;
• wherein the DSC exothermic peak of the second adhesive layer is 125° C. to 127.5° C.