Circuit board with embedded passive component and manufacturing method thereof

A method of making a semiconductor device substrate comprising:

• (a) providing a first dielectric layer, a first patterned conductive layer, and a metal layer, the first dielectric layer having a first surface and an opposing second surface, the first patterned conductive layer disposed on the first surface, and the metal layer disposed on the second surface;
• (b) removing a part of the first dielectric layer and a part of the metal layer, to form an accommodation space;
• (c) attaching a support member to the metal layer;
• (d) placing an electronic component in the accommodation space and on the support member;
• (e) laminating a second dielectric layer to the first surface of the first dielectric layer to envelop the electronic component;
• and
• (f) removing the support member from the metal layer subsequent to the lamination of (e) to expose the electronic component.

A circuit board, comprising:

• a base layer having a first surface and an opposing second surface, the base layer defining an opening from the first surface to the second surface;
• a component disposed within the opening defined by the base layer, wherein the component fills a portion of the opening such that a gap is defined between the component and the base layer, the component comprising an electrical contact;
• an insulating layer disposed on the first surface of the base layer, the insulating layer including a wall portion filling the gap defined between the component and the base layer;
• a first patterned conductive layer within the base layer and exposed from the second surface of the base layer;
• and
• a conductor disposed on the electrical contact and on the first patterned conductive layer, wherein the conductor is configured to form an electrical connection between the electrical contact and the first patterned conductive layer.