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US 9,426,888 B2Granted
Substrate for mounting electrical connector
Assignee3M Innovative Properties Company
InventorsSaujit Bandhu, YunLong Qiao, Vincent Tan
Life of this patent
Estimating the term…
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Assignee3M Innovative Properties Company
InventorsSaujit Bandhu, YunLong Qiao, Vincent Tan
Estimating the term…
A substrate comprises a first plurality of conductive pads disposed on a first side of the substrate and a different second plurality of conductive pads disposed on the first side of the substrate. Each conductive pad in the first plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSAS plug connector when the MicroSAS plug connector is mounted onto the substrate. Each conductive pad in the second plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSATA plug connector when the MicroSATA plug connector is mounted onto the substrate. At least one conductive pad belongs to both the first and second pluralities of conductive pads.
A substrate comprising:
A plastic cover for covering at least portions of contact tails of a surface mount connector, the plastic cover comprising a top surface and a structured bottom surface comprising a plurality of elongated spaced apart parallel ridges defining a plurality of elongated parallel channels therebetween, the channels extending from a front side of the plastic cover toward an opposite back side of the plastic cover, each channel corresponding to a different contact tail of the surface mount connector and being configured to cover the contact tail along at least a portion of a length of the contact tail, such that when the surface mount connector is mounted, the plastic cover is placed in a position so that the back side of the plastic cover is near and along a mounting face of the surface mount connector resulting in each contact tail of the surface mount connector being housed within a different channel.
Dependencies are inferred from the claim text.