Wiring board and electronic device using the same
AssigneeKYOCERA Corporation
InventorsYoshihiro Hosoi, Takayuki Taguchi, Hidetoshi Yugawa
Life of this patent
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Abstract
A wiring board according to the present invention includes an insulating board; a first pad provided inwardly from a surface of the insulating board and electrically connected to an electrode of an electronic component; a second pad provided on the surface of the insulating board and electrically connected to a lead terminal. The first pad and the second pad include a first layer region made of copper and a second layer region arranged on the first layer region and made of nickel, and a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.
Claims8
A wiring board comprising:
- an insulating board for mounting an electronic component on a surface thereof, the insulating board including a first insulating layer having a through-hole positioned at an uppermost layer and a second insulating layer positioned in close proximity to the first insulating layer below the first insulating layer;
- a first pad provided on the second insulating layer and having an upper surface which is at least partially exposed in the through-hole and electrically connected to an electrode provided on a surface of the electronic component;
- a second pad provided on the first insulating layer excluding the through hole and electrically connected to a lead terminal to be connected to an external circuit,
- wherein the first pad and the second pad include a first layer region made of copper, and a second layer region arranged on the first layer region and made of nickel, and
- a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.
Dependencies are inferred from the claim text.