US 9,426,886 B2 · Electrical connection with reduced topography

Abstract

The formation of substrate electrical connections on thin film heads is one source of resulting surface topography. In accordance with one implementation, such topography can be reduced by a process that includes depositing a first layer of basecoat, creating electrical recessed vias in one or more plating processes, and depositing a second layer of basecoat on top of the electrical vias and on top of the first layer of basecoat. In one implementation, the first and second layers of basecoat have a combined height that is substantially equal to the height of the electrical recessed vias. In one implementation, the resulting topographical features are small enough that they can be planarized without creating a lack of uniformity in the total basecoat thickness across the wafer.

Claims20

Dependent claims

A layered microelectronic structure comprising:

a basecoat layer on a substrate;
an electrical via in the basecoat layer that has a base portion and an upper portion, wherein the upper portion has an outer casing and an interior prong, the upper portion has a width that is greater than a width of the base portion, and the electrical via contacts the substrate at an end of the base portion;
and
a contact pad that contacts the upper portion of the electrical via and is axially aligned with the base portion and the upper portion, wherein the contact pad is electrically connected to the substrate by the electrical via.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

13/753,730Filed 30 Jan 2013

Published

US 2014/0209368 A131 Jul 2014

Granted

23 Aug 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections
G11B 5/102
Structure or manufacture of housings or shields for heads: manufacture of housing
G11B 5/3173
Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional…:…
G11B 5/6094
Specially adapted for spacing from a rotating disc using a fluid cushion: preventing or discharging electrostatic charge build-up on the flying head

Electrical connection with reduced topography

Life of this patent

Electrical connection with reduced topography

Life of this patent

Abstract

Claims20