Multi-layer micro-wire structure
AssigneeEastman Kodak Company
InventorsTodd Mathew Spath, Ronald Steven Cok
Life of this patent
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Abstract
A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.
Claims18
A multi-layer micro-wire structure resistant to cracking, comprising:
- a substrate having a surface;
- one or more micro-channels formed in the substrate;
- an electrically conductive first material composition forming a first layer located in each micro-channel;
- and
- an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, wherein the first material composition is susceptible to cracking when the multi-layer micro-wire structure is flexed such that gaps are formed in the first material composition, and wherein the second material composition forms an electrical connection that bridges the formed gaps, whereby the multi-layer micro-wire is resistant to cracking.
A multi-layer micro-wire structure resistant to cracking, comprising:
- a substrate having a surface;
- one or more micro-channels formed in the substrate;
- an electrically conductive first material composition forming a first layer located in each micro-channel;
- and
- an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking;
- wherein the micro-wires are patterned to form a plurality of separate, spaced-apart electrodes, each electrode including a plurality of electrically connected multi-layer micro-wires;
- further including an unpatterned conductive layer electrically connected to the electrodes.
A multi-later micro-wire structure resistant to cracking, comprising:
- a substrate having a surface;
- one or more micro-channels formed in the substrate;
- an electrically conductive first material composition forming a first layer located in each micro-channel;
- and
- an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking;
- further including a third layer located in the micro-channel on a side of the second layer opposite the first layer, wherein the third layer includes light-absorbing material.
Dependencies are inferred from the claim text.