System and method for lead frame package degating
AssigneeFreescale Semiconductor, Inc.
InventorsSheila F. Chopin, Varughese Mathew
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Abstract
A method of forming an electronic component includes masking a lead frame to form a mask defining an exposed area, oxidizing the exposed area of the lead frame, wherein the mask inhibits oxidation of an unexposed area, and removing the mask from the lead frame following oxidizing. A lead frame can include a metal sheet patterned to define a pad region and leads. The metal sheet includes metal oxide in a select area. The pad region is substantially free of metal oxide.
Claims20
A lead frame comprising a metal sheet patterned to define a plurality of pad sites, each pad site of the plurality of pad sites including a pad region and leads, a runner area defined between two pad sites of the plurality of pad sites, the patterned metal sheet including metal oxide in a select area corresponding to at least the runner area, the pad region substantially free of the metal oxide.
A method of forming an electronic component, the method comprising:
- masking a lead frame to form a mask defining an exposed area;
- oxidizing the exposed area of the lead frame, wherein the mask inhibits oxidation of an unexposed area;
- and
- removing the mask from the lead frame following oxidizing.
A method of forming an electronic component, the method comprising:
- attaching a die to a lead frame, the lead frame including a first surface area having metal oxide and a second surface area substantially free of metal oxide, the die attached to the second surface area;
- inserting the die and the lead frame into a mold;
- applying a mold compound to the first and second surface areas, the mold compound encapsulating the die;
- and
- removing the mold compound from the first surface area of the lead frame.
Dependencies are inferred from the claim text.