Low profile, highly configurable, current sharing paralleled wide band gap power device power module

A power module apparatus, comprising:

• a base plate defining a topology pattern;
• a power substrate positioned above the base plate;
• at least two power contacts, each of the at least two power contacts electrically connected to the power substrate;
• at least two parallel shared current path power devices electrically connected to the at least two power contacts;
• a gate and source board mounted above the power substrate, the gate and source board including a first interconnection channel and a second interconnection channel, each interconnection channel mounted in an interconnection position selected from a position group, the position group consisting of a first interconnection position, a second interconnection position, a third interconnection position, and a fourth interconnection position;
• gate drive connectors electrically connected to the gate and source board;
• a housing secured to the power substrate, the gate drive connectors and the at least two power contacts extending through the housing, the housing defining fastener apertures;
• fasteners positioned in the fastener apertures;
• and
• the at least two power contacts bent over the fastener apertures to retain the fasteners in the fastener apertures.