Electronic devices with yielding substrates
AssigneeCooledge Lighting Inc.
InventorsMichael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
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Abstract
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Claims22
A method for operating a lighting system that comprises (i) a primary lighting module, (ii) a plurality of nearest-neighbor lighting modules proximate the primary lighting module, and (iii) a plurality of next-nearest neighbor lighting modules each disposed at a distance away from the primary lighting module greater that a distance between a nearest-neighbor lighting module and the primary lighting module, the method comprising:
- sensing a characteristic with the primary lighting module;
- with the primary lighting module, emitting light having a first intensity determined at least in part by the sensed characteristic;
- with each nearest-neighbor lighting module, emitting light having a second intensity determined at least in part by the first intensity of light emitted by the primary lighting module without sensing the characteristic sensed by the primary lighting module;
- and
- with each next-nearest-neighbor lighting module, emitting light having a third intensity determined at least in part by the second intensity of light emitted by each nearest-neighbor lighting module without sensing the characteristic sensed by the primary lighting module.
Dependencies are inferred from the claim text.