Top port microelectromechanical systems microphone

A microphone package, comprising:

• a substrate;
• a microelectromechanical system (MEMS) microphone attached to the substrate using die attachments comprising anchors that are external to the MEMS microphone, wherein gaps between the anchors couple a first volume of air under a bottom side of the MEMS microphone to a second volume of air, and wherein the anchors are mechanically attached to the substrate and to opposite sides of respective outside edges of the MEMS microphone;
• a flexible seal placed on a portion of the top side of the MEMS microphone;
• and
• an enclosure placed on the flexible seal and secured to the substrate, wherein the flexible seal separates a front cavity corresponding to a top side of the MEMS microphone from a back cavity comprising the first volume of air and the second volume of air, wherein an opening of the enclosure corresponding to the front cavity is adapted to couple acoustic pressure to the top side of the MEMS microphone, and wherein the back cavity is included within a portion of the enclosure.

A method, comprising:

• attaching a microelectromechanical (MEMS) microphone to a substrate;
• attaching die material, external to the MEMS microphone, to the substrate and to respective sides of the MEMS microphone at a periphery of the MEMS microphone, wherein gaps between portions of the die material acoustically couple a first volume under the MEMS microphone with a second volume to form a back volume;
• placing an acoustic seal on the MEMS microphone;
• and
• placing a package lid on the acoustic seal and securing the package lid to the substrate, wherein a first portion of the package lid comprises an opening adapted to couple, via a front volume, sound to a top side of the MEMS microphone, wherein the back volume is included within a second portion of the package lid, and wherein the acoustic seal isolates the front volume from the back volume.