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US 9,426,399 B2Granted
Solid-state imaging device, method of manufacturing the same, and electronic apparatus
AssigneeSony Corporation
InventorTetsuji Yamaguchi
Life of this patent
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Abstract
A solid state imaging device that includes a substrate having oppositely facing first and second surfaces and a photoelectric conversion unit layer having a light incident side facing away from the substrate. The substrate includes a first photoelectric conversion unit and a second photoelectric conversion and the photoelectric conversion layer includes a third photoelectric conversion unit.
Claims20
An electronic apparatus, comprising:
- an optical system operative to guide incident light;
- a solid state imaging device that receives light from the optical system, the solid state imaging device including:
- a substrate having oppositely facing first and second surfaces;
- a photoelectric conversion unit layer having a light incident side facing away from the substrate;
- a first photoelectric conversion unit and a second photoelectric conversion unit within the substrate;
- and
- a third photoelectric conversion unit within the photoelectric conversion unit layer, the third photoelectric conversion unit including:
- a photoelectric conversion material layer;
- an upper electrode above a surface of the photoelectric conversion material layer facing a light incident surface;
- and
- a lower electrode above a surface of the photoelectric conversion material layer facing the substrate,
- wherein,
- a signal charge in the third photoelectric conversion unit is transferred therefrom via the lower electrode;
- a driving circuit that drives the solid state imaging device;
- and
- a signal processing circuit that processes an output signal of the solid state imaging device.
13 more elements
An electronic apparatus, comprising:
- an optical system;
- a solid state imaging device that receives light from the optical system, the solid state imaging device including:
- a substrate having oppositely facing first and second surfaces;
- a photoelectric conversion unit layer having a light incident side facing away from the substrate;
- a first photoelectric conversion unit and a second photoelectric conversion unit within the substrate;
- and
- a third photoelectric conversion unit within the photoelectric conversion unit layer, wherein an insulating layer having a fixed negative voltage is between the photoelectric conversion unit layer and the substrate, and wherein the insulating layer is made of HfO2,
- a driving circuit that drives the solid state imaging device;
- and
- a signal processing circuit that processes an output signal of the solid state imaging device.
7 more elements
An electronic apparatus, comprising:
- an optical system;
- a solid state imaging device that receives light from the optical system, the solid state imaging device including:
- a plurality of pixels arranged in a matrix having rows and columns, each pixel comprising:
- at least a portion of a substrate having oppositely facing first and second substrate surfaces;
- a photoelectric conversion unit layer having a light incident side facing away from the substrate;
- a first photoelectric conversion unit and a second photoelectric conversion unit within the at least a portion of a substrate;
- and
- a third photoelectric conversion unit within the photoelectric conversion unit layer, wherein each pixel further comprises a thin film transistor within the photoelectric conversion unit layer, the thin film transistor configured to read a signal charge of the third photoelectric conversion unit, and wherein drain regions of the thin film transistors arranged along a common vertical line are commonly connected via a common wire;
- a driving circuit that drives the solid state imaging device;
- and
- a signal processing circuit that processes an output signal of the solid state imaging device.
8 more elements
An electronic apparatus, comprising:
- an optical system;
- a solid state imaging device that receives light from the optical system, the solid state imaging device including:
- a plurality of pixels arranged in a matrix having rows and columns, each pixel comprising:
- at least a portion of a substrate having oppositely facing first and second substrate surfaces;
- a photoelectric conversion unit layer having a light incident side facing away from the substrate;
- a first photoelectric conversion unit and a second photoelectric conversion unit within the at least a portion of a substrate;
- and
- a third photoelectric conversion unit within the photoelectric conversion unit layer, wherein the first and second photoelectric conversion units of a pair of pixels diagonally adjacent to each other relative to the rows and columns share a floating diffusion unit;
- a driving circuit that drives the solid state imaging device;
- and
- a signal processing circuit that processes an output signal of the solid state imaging device.
8 more elements
Dependencies are inferred from the claim text.