High pass filters and low pass filters using through glass via technology

A low pass filter, comprising:

• a glass substrate having a plurality of through substrate vias;
• a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
• at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
• a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
• a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;
• a first of the 3D inductors coupled in series to a first of the plurality of capacitors, between a filter input and a ground terminal;
• a second of the 3D inductors coupled between the filter input and a filter output and coupled in parallel to a second of the plurality of capacitors;
• and
• a third of the 3D inductors coupled to the filter output and to a third of the plurality of capacitors that is coupled to the ground terminal.

A low pass filter, comprising:

• a glass substrate having a plurality of through substrate vias;
• a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
• at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
• a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
• a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;
• a first of the plurality of capacitors coupled in series to a first of the 3D inductors, between a filter input and a ground terminal;
• a second of the plurality of capacitors coupled between the filter input and a filter output and coupled in parallel to a second of the 3D inductors;
• and
• a third of the plurality of capacitors is coupled to the filter output and to a third of a third of the 3D inductors that is coupled to the ground terminal.

A high pass filter, comprising:

• a glass substrate having a plurality of through substrate vias;
• a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
• at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
• a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
• a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;
• a first of the plurality of capacitors coupled in series with a third of the plurality of capacitors, between a filter input and a ground terminal;
• and
• the at least one 3D inductor coupled in series with a second of the plurality of capacitors between the first of the plurality of capacitors and the third of the plurality of capacitors and the ground terminal.

A high pass filter, comprising:

• a glass substrate having a plurality of through substrate vias;
• a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
• at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
• a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
• a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;
• a first of the plurality of capacitors coupled in series with a second of the plurality of capacitors, between a filter input and a ground terminal;
• and
• the at least one 3D inductor coupled between the first of the plurality of capacitors and the second of the plurality of capacitors and the ground terminal.

A method of fabricating a filter, comprising:

• forming a plurality of through substrate vias in a glass substrate;
• depositing a first plurality of traces on a first surface of the glass substrate;
• depositing a second plurality of traces on a second surface of the glass substrate, the first plurality of traces and the second plurality of traces having a width and/or thickness less than a printing resolution;
• coupling the first plurality of traces to first sides of the plurality of through substrate vias;
• coupling the second plurality of traces to second sides of the plurality of through substrate vias, the plurality of through substrate vias and traces surrounding a solid glass core of the glass substrate to form at least one 3D inductor;
• and
• forming at least one capacitor on the glass substrate, a width of the at least one capacitor being less than ten micrometers and a thickness of the at least one capacitor less than one micrometer, the width and thickness of the at least one capacitor being less than a width and thickness of a capacitor fabricated using a printing process, in which the at least one capacitor is coupled to a trace of the at least one 3D inductor.

A filter comprising:

• a glass substrate having a plurality of through substrate vias;
• means for storing charge supported by the glass substrate, a width of the charge storing means being less than ten micrometers and a thickness of the charge storing means less than one micrometer, the width and thickness of the charge storing means being less than a width and thickness of a capacitor fabricated using a printing process;
• and
• at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
• first means for coupling on a first surface of the glass substrate, the first means for coupling coupled to the plurality of through substrate vias;
• and
• second means for coupling on a second surface of the glass substrate, opposite the first surface, the second means for coupling coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias, the first means for coupling and the second means for coupling surrounding a solid glass core of the glass substrate and operating as the at least one 3D inductor, the first means for coupling and the second means for coupling having a width and/or thickness less than the printing resolution in which the charge storing means is coupled to the first coupling means of the at least one 3D inductor.

A low pass filter, comprising:

• a glass substrate having a plurality of through substrate vias;
• means for storing charge supported by the glass substrate, the charge storing means having a width and/or thickness less than a printing resolution;
• at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
• first means for coupling on a first surface of the glass substrate, the first means for coupling coupled to the plurality of through substrate vias, and
• second means for coupling on a second surface of the glass substrate, opposite the first surface, the second means for coupling coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias, the first means for coupling and the second means for coupling operating as the at least one 3D inductor, the first means for coupling and the second means for coupling having a width and/or thickness less than the printing resolution;
• a first of the 3D inductors coupled in series to a first of the charge storing means, between a filter input and a ground terminal;
• a second of the 3D inductors coupled between the filter input and a filter output and coupled in parallel to a second of the charge storing means;
• and
• a third of the 3D inductors coupled to the filter output and to a third of the charge storing means that is coupled to the ground terminal.

A high pass filter, comprising:

• a glass substrate having a plurality of through substrate vias;
• means for storing charge supported by the glass substrate, the charge storing means having a width and/or thickness less than a printing resolution;
• at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
• first means for coupling on a first surface of the glass substrate, the first means for coupling coupled to the plurality of through substrate vias, and
• second means for coupling on a second surface of the glass substrate, opposite the first surface, the second means for coupling coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias, the first means for coupling and the second means for coupling operating as the at least one 3D inductor, the first means for coupling and the second means for coupling having a width and/or thickness less than the printing resolution;
• a first of the charge storing means coupled in series with a third of the charge storing means, between a filter input and a ground terminal;
• and
• the at least one 3D inductor coupled in series with a second of the charge storing means between the first charge storing means and the third charge storing means and the ground terminal.

A method of fabricating a filter, comprising:

• the step of forming a plurality of through substrate vias in a glass substrate;
• the step of depositing a first plurality of traces on a first surface of the glass substrate;
• the step of depositing a second plurality of traces on a second surface of the glass substrate, the first plurality of traces and the second plurality of traces having a width and/or thickness less than a printing resolution;
• the step of coupling the first plurality of traces to first sides of the plurality of through substrate vias;
• the step of coupling the second plurality of traces to second sides of the plurality of through substrate vias, the plurality of through substrate vias and traces surrounding a solid glass core of the glass substrate to form at least one 3D inductor;
• and
• the step of forming at least one capacitor on the glass substrate, a width of the at least one capacitor being less than ten micrometers and a thickness of the at least one capacitor less than one micrometer, the width and thickness of the at least one capacitor being less than a width and thickness of a capacitor fabricated using a printing process.