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US 9,425,373 B2Granted
Light emitting module
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTakanori Aketa, Yoshiharu Sanagawa, Mitsuhiko Ueda, Takaaki Yoshihara, Shintaro Hayashi, Toshihiko Sato
Life of this patent
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Abstract
A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.
Claims12
A light emitting module comprising:
- a first substrate including a resin having insulation properties, and a copper component embedded in the resin;
- a second substrate above the copper component, the second substrate being soldered to the copper component;
- a mounting electrode above the second substrate;
- and
- a light emitting element above the mounting electrode, the light emitting element being gold-tin soldered to the mounting electrode,
- wherein an aluminum film is formed above the second substrate;
- the aluminum film is (i) a reflection film that reflects light emitted from the light emitting element, and (ii) a wiring through which a current for causing the light emitting element to emit light;
- and
- the mounting electrode is formed above the aluminum film in contact with the aluminum film.
6 more elements
Dependencies are inferred from the claim text.