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US 9,425,372 B2Granted
LED device, method of manufacturing the same, and light-emitting apparatus
AssigneeJapan Aviation Electronics Industry, Limited
InventorHideyuki Kanno
Life of this patent
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Abstract
The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.
Claims17
An LED device to be connected to a socket connector, comprising:
- a device body made of plastic and having a first surface and a second surface opposite to the first surface;
- a plurality of metal contacts insert-molded in the device body and each having a first end portion placed on the first surface and a second end portion opposite to the first end portion;
- and
- a plurality of LED bare chips mounted directly on the first end portions of the metal contacts, respectively,
- wherein the second end portions of the metal contacts protrude outward of the device body from the second surface, thereby forming terminal portions each of which has a plate shape perpendicular to the second surface,
- wherein each of the terminal portions extends lengthily along the second surface to fit snugly with an elongated socket of the socket connector, and
- wherein power supply to the LED bare chips and heat radiation from the LED bare chips are carried out through the metal contacts.
4 more elements
Dependencies are inferred from the claim text.