Light emitting device package
AssigneeLG Innotek Co., Ltd.
InventorsWan Ho Kim, Jun Seok Park
Life of this patent
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Abstract
A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
Claims16
A semiconductor light emitting device package, comprising:
- a first lead electrode;
- a second lead electrode;
- at least one light emitting device disposed on the first lead electrode;
- a package body having a cavity;
- and
- a resin material disposed in the cavity,
- wherein the cavity comprises a first cavity and a second cavity connected to the first cavity,
- wherein the first cavity is positioned in a central portion of the package body,
- wherein the second cavity is formed under a central portion of the first cavity,
- wherein a bottom surface of at least one of the first lead electrode or the second lead electrode is exposed to a bottom surface of the package body,
- wherein the first lead electrode and the second lead electrode are separated from each other by a gap, and a portion of the package body is disposed in the gap,
- wherein the first lead electrode comprises a recessed portion covering a side surface and a bottom surface of the second cavity,
- wherein a bottom surface of the recessed portion of the first lead electrode is flush with the bottom surface of the package body, and
- wherein a lowermost surface of at least one of the first lead electrode or the second lead electrode extended to an outside of the package body is lower than the bottom surface of the at least one of the first lead electrode or the second lead electrode.
A semiconductor light emitting device package, comprising:
- a first lead electrode;
- a second lead electrode;
- at least one light emitting device disposed on the first lead electrode;
- a package body having a cavity;
- and
- a resin material disposed in the cavity,
- wherein the cavity comprises a first cavity and a second cavity connected to the first cavity,
- wherein the first cavity is positioned in a central portion of the package body,
- wherein the second cavity is formed under a central portion of the first cavity,
- wherein a bottom surface of at least one of the first lead electrode or the second lead electrode is exposed to a bottom surface of the package body,
- wherein the first lead electrode and the second lead electrode are separated from each other by a gap, and a portion of the package body is disposed in the gap,
- wherein the first lead electrode comprises a recessed portion covering a side surface and a bottom surface of the second cavity,
- wherein a bottom surface of the recessed portion of the first lead electrode is flush with the bottom surface of the package body, and
- wherein the bottom surface of the package body has a recessed bottom portion with reference to edges of the package body.
Dependencies are inferred from the claim text.