Thin film solar module and method for production of the same

A thin film solar module, comprising:

• at least one first sub module including a plurality of first thin film solar cells connected with one another in series;
• and
• at least one second sub module connected with the at least one first sub module in parallel, the second sub module including a plurality of second thin film solar cells connected with one another in series,
• wherein a voltage produced by the plurality of first thin film solar cells has a polarity opposite of a voltage produced by the plurality of second thin film solar cells,
• wherein the at least one first sub module and the at least one second sub module are jointly formed on a shared substrate in a monolithic manner through deposition,
• wherein a first connecting cell including the first thin film solar cells and a second connecting cell including the second thin film solar cells are arranged adjacent to one another, spaced apart from each other through an insulation trench and electrically connected with one another through a shared contact,
• wherein the shared contact is directly contacting on a semiconductor layer of the first connecting cell and a semiconductor layer of the second connecting cell,
• wherein the semiconductor layer of the first connecting cell is directly contacting the insulation trench,
• wherein the semiconductor layer of the second connecting cell is directly contacting the insulation trench,
• wherein the first connecting cell and the second connecting cell are photovoltaically active,
• wherein the insulation trench is between the first sub module and the second sub module,
• wherein the first and the second thin film solar cells are strip shaped and the insulation trench essentially extends along an entire length of the first and second connecting cells,
• wherein no semiconductor material is positioned between the first connecting cell and the second connecting cell,
• wherein a front side contact layer of the first sub module and a front side contact layer of the second sub module directly contact the shared substrate,
• wherein a back side contact layer of the first sub module is connected with the semiconductor layer of the first connecting cell and a back side contact layer of the second sub module is connected the semiconductor layer of the second connecting cell,
• wherein the semiconductor layer of the first connecting cell is between the back side contact layer of the first sub module and the front side contact layer of the first module,
• wherein the semiconductor layer of the second connecting cell is between the back side contact layer of the second sub module and the front side contact layer of the second module,
• wherein the back side contact layer of the first sub module, the back side contact layer of the second sub module, and the shared contact are formed from a common layer,
• wherein the shared substrate is a single piece of material having only one portion, and,
• wherein each sub module is separated by an insulation trench that extends completely through the front side contact layer.