High electron mobility transistors
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Chun Liu, Chung-Yi Yu, Chi-Ming Chen, Chen-Hao Chiang
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Chun Liu, Chung-Yi Yu, Chi-Ming Chen, Chen-Hao Chiang
Estimating the term…
The present disclosure relates to a donor layer of bi-layer AlGaN and associated method of fabrication within a high electron mobility transistor (HEMT) configured to provide low-resistance ohmic source and drain contacts to reduce power consumption, while maintaining a high-mobility of a two-dimensional electron gas (2DEG) within a channel of the HEMT. The donor layer of bi-layer AlGaN comprises a mobility-enhancing layer of AlzGa(1-z)N, a resistance-reducing layer of AlxGa(1-x)N disposed over the mobility-enhancing layer, wherein the ohmic source and drain contacts connect to the HEMT. A channel layer of GaN is disposed beneath the mobility-enhancing layer, wherein a 2DEG resides, forming the channel of the HEMT.
A high electron mobility transistor (HEMT), comprising:
A transistor, comprising:
A method to form a high electron mobility transistor (HEMT), comprising:
Dependencies are inferred from the claim text.