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US 9,425,180 B2Granted
Treating copper surfaces for packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Horng Chang, Tin-Hao Kuo
Life of this patent
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Abstract
A die has a top surface, and a metal pillar having a portion protruding over the top surface of the die. A sidewall of the metal pillar has nano-wires. The die is bonded to a package substrate. An underfill is filled into the gap between the die and the package substrate.
Claims20
A method comprising:
- performing a chemical treatment on a metal pillar of a first package component to generate nano-wires on a sidewall of the metal pillar, wherein the nano-wires comprise a metal oxide.
A method comprising:
- forming a metal pillar on a top surface of a first package component;
- forming a conductive layer contacting a top surface of the metal pillar;
- and
- forming nano-wires on a sidewall surface of the metal pillar, wherein the nano-wires comprise an oxide.
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A method comprising:
- forming a metal pillar on a top surface of a first package component, wherein the metal pillar comprises a top surface and a sidewall surface;
- forming a solder layer covering the top surface of the metal pillar;
- and
- treating the sidewall surface of the metal pillar in a chemical solution, wherein the chemical solution comprises a chemical selected from the group consisting essentially of sodium chlorite (NaClO2), sodium hydroxide (NaOH), sodium phosphate (NaPO4), and combinations thereof.
1 more element
Dependencies are inferred from the claim text.