Chip packages and methods of manufacture thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien Ling Hwang, Pei-Hsuan Lee, Ying-Jui Huang, Yeong-Jyh Lin, Chung-Shi Liu
Life of this patent
Estimating the term…
Abstract
Chip packages and methods of manufacture thereof are described. In an embodiment, a method for manufacturing a chip package may include: providing a support structure including: a base; and a stage pivotably attached to the base, the stage having a surface facing away from the base; attaching a first die having at least one second die disposed thereon to the surface of the stage; pivotably tilting the stage; and after the pivotably tilting, dispensing an underfill over the first die and adjacent to the least one second die, the underfill flowing through a first standoff gap disposed between the first die and the at least one second die.
Claims20
A method comprising:
- providing a support structure having a chip stack attached to an inclined surface of the support structure, the chip stack comprising:
- a substrate;
- a first integrated circuit die, the first integrated circuit die having contact pads on a top major surface thereof and on a bottom major surface thereof, the contact pads on the bottom major surface of the first integrated circuit die being mounted to the substrate by connectors;
- a first underfill material encapsulating the connectors;
- at least one second die disposed over the first integrated circuit die, a first second die of the at least one second die being mounted on the first integrated circuit die and electrically connected to the contact pads on the top major surface of the first integrated circuit die by second connectors;
- and
- a first standoff gap between the first integrated circuit die and the at least one second die, wherein the at least one second die has a first sidewall and a second sidewall opposite the first sidewall, the first sidewall disposed higher on the inclined surface of the support structure than the second sidewall;
- and
- dispensing a second underfill over the first integrated circuit die and adjacent to the first sidewall of the at least one second die, the second underfill flowing through the first standoff gap from the first sidewall to the second sidewall of the at least one second die.
A method comprising:
- providing a support structure comprising:
- a base;
- and
- a stage pivotably attached to the base, the stage having a surface facing away from the base;
- attaching a first die having at least one second die disposed thereon to the surface of the stage;
- generating a magnetic field to pivotably tilt the stage;
- and
- after the pivotably tilting, dispensing an underfill over the first die and adjacent to the at least one second die, the underfill flowing through a first standoff gap disposed between the first die and the at least one second die.
A method, comprising:
- placing a chip stack on a support structure comprising a base, a stage pivotably attached to the base, and resilient structures attached between lateral portions of the base and lateral portions of the stage;
- pivotably tilting the stage of the support structure to form an inclined stage, the resilient structures dampening the tilting of the stage;
- and
- dispensing an underfill over a portion of the chip stack.
Dependencies are inferred from the claim text.