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US 9,425,170 B2Granted
Stacked chips electrically connected by a plurality of juncture portions
AssigneeRohm Co., Ltd.
InventorHidekazu Kikuchi
Life of this patent
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Abstract
An inventive semiconductor device includes: a first semiconductor chip; a second semiconductor chip having a front surface opposed to a front surface of the first semiconductor chip; a first electrode region including a first electrode provided between the first semiconductor chip and the second semiconductor chip to electrically connect the first semiconductor chip to the second semiconductor chip; and a juncture portion provided between the first semiconductor chip and the second semiconductor chip as surrounding the first electrode region to connect the first semiconductor chip to the second semiconductor chip.
Claims13
A semiconductor device comprising:
- a first semiconductor chip;
- a second semiconductor chip having a front surface opposed to a front surface of the first semiconductor chip;
- a first electrode region including a first electrode provided between the first semiconductor chip and the second semiconductor chip to electrically connect the first semiconductor chip to the second semiconductor chip;
- an external terminal connected to at least one of the first semiconductor chip and the second semiconductor chip;
- and
- a conductive juncture portion provided between the first semiconductor chip and the second semiconductor chip as surrounding the first electrode region to connect the first semiconductor chip to the second semiconductor chip, the conductive juncture portion being entirely disposed outside the external terminal.
3 more elements
A semiconductor device comprising:
- a first semiconductor chip;
- a second semiconductor chip having a front surface opposed to a front surface of the first semiconductor chip;
- a first electrode region including a first electrode provided between the first semiconductor chip and the second semiconductor chip to electrically connect the first semiconductor chip to the second semiconductor chip;
- a conductive juncture portion provided between the first semiconductor chip and the second semiconductor chip as surrounding the first electrode region to connect the first semiconductor chip to the second semiconductor chip;
- a first insulation layer provided on the front surface of the first semiconductor chip;
- and
- a second insulation layer provided on the front surface of the second semiconductor chip;
- wherein the first electrode includes:
- a first bump provided on the front surface of the first semiconductor chip;
- and
- a second bump provided on the front surface of the second semiconductor chip to be electrically connected to the first bump,
- wherein the juncture portion includes:
- a first juncture portion provided on the front surface of the first semiconductor chip;
- and
- a second juncture portion provided on the front surface of the second semiconductor chip to be connected to the first juncture portion,
- wherein the first bump and the first juncture portion extend thicknesswise through the first insulation layer so as to be flush with a surface of the first insulation layer;
- wherein the second bump and the second juncture portion extend thicknesswise through the second insulation layer so as to be flush with a surface of the second insulation layer.
14 more elements
A semiconductor device comprising:
- a first semiconductor chip;
- a second semiconductor chip having a front surface opposed to a front surface of the first semiconductor chip;
- a first electrode region including a first electrode provided between the first semiconductor chip and the second semiconductor chip to electrically connect the first semiconductor chip to the second semiconductor chip;
- an external terminal connected to at least one of the first semiconductor chip and the second semiconductor chip;
- and
- a conductive juncture portion provided between the first semiconductor chip and the second semiconductor chip to surround the first electrode region to connect the first semiconductor chip to the second semiconductor chip, the conductive juncture portion being disposed on an outer lateral side of the external terminal.
3 more elements
Dependencies are inferred from the claim text.