Flexible stack packages having wing portions
AssigneeSK hynix Inc.
InventorJong Hoon Kim
Life of this patent
Estimating the term…
Abstract
A flexible stack package includes a first package and a second package. Each of the first and second packages includes a flexible layer, a chip embedded in the flexible layer, and a contact portion disposed on the chip to penetrate the flexible layer and exposed at a surface of the flexible layer. Each of the first and second packages includes a fixing portion and a wing portion. A first adhesion part is disposed between the fixing portion of the first package and the fixing portion of the second package to combine the first package with the second package. A first stretchable interconnector electrically connects or couples the contact portion of the first package to the contact portion of the second package.
Claims20
A flexible stack package comprising:
- a first package and a second package, each of the packages including:
- a fixing portion;
- a wing portion;
- and
- a chip embedded in a flexible layer, the flexible layer exposing a contact portion disposed on the chip;
- a first adhesion part binding the fixing portion of the first package to the fixing portion of the second package without protruding into a first surface of the first package and a second surface of the second package, the first surface and the second surface facing each other;
- and
- a first stretchable interconnector electrically coupling the contact portion of the first package to the contact portion of the second package.
A memory card comprising:
- a memory;
- and
- a memory controller controlling an operation of the memory;
- wherein the memory or the memory controller includes:
- a first package including:
- a flexible layer;
- a chip embedded in the flexible layer;
- a contact portion disposed on the chip, the contact portion exposed at a surface of the flexible layer;
- a fixing portion;
- and
- a wing portion;
- a second package including:
- a flexible layer;
- a chip embedded in the flexible layer;
- a contact portion disposed on the chip, the contact portion exposed at a surface of the flexible layer;
- a fixing portion;
- and
- a wing portion;
- a first adhesion part disposed between the fixing portion of the first package and the fixing portion of the second package to combine the first package with the second package without protruding into a first surface of the first package and a second surface of the second package, the first surface and the second surface facing each other;
- and
- a first stretchable interconnector electrically coupling the contact portion of the first package and the contact portion of the second package.
An electronic system comprising:
- a memory;
- and
- a controller coupled with the memory through a bus,
- wherein the memory or the controller includes:
- a first package including:
- a flexible layer;
- a chip embedded in the flexible layer;
- a contact portion disposed on the chip, the contact portion exposed at a surface of the flexible layer a fixing portion;
- and
- a wing portion;
- a second package including:
- a flexible layer;
- a chip embedded in the flexible layer;
- a contact portion disposed on the chip, the contact portion exposed at a surface of the flexible layer;
- a fixing portion;
- and
- a wing portion;
- a first adhesion part disposed between the fixing portion of the first package and the fixing portion of the second package to combine the first package with the second package without protruding into a first surface of the first package and a second surface of the second package, the first surface and the second surface facing each other;
- and
- a first stretchable interconnector electrically coupling the contact portion of the first package and the contact portion of the second package.
Dependencies are inferred from the claim text.