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US 9,425,162 B2Granted
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
AssigneeKulicke and Soffa Industries, Inc.
InventorsMatthew B. Wasserman, Michael P. Schmidt-Lange
Life of this patent
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Abstract
A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.
Claims14
A method of operating a thermocompression bonding machine, the method comprising the steps of:
- (a) thermocompressively bonding a workpiece to a substrate at a bonding station of the thermocompression bonding machine using a placer tool;
- (b) moving the placer tool to an intermediate cooling stage of the thermocompression bonding machine;
- and
- (c) contacting the intermediate cooling stage with the placer tool to remove heat from the placer tool.
1 more element
Dependencies are inferred from the claim text.