Wafer-level package device with solder bump reinforcement

A semiconductor device, comprising:

• a printed circuit board;
• and
• a semiconductor device including
• an integrated circuit chip;
• an adhesion interface disposed on a surface of the integrated circuit chip;
• at least one bump interface disposed on the surface of the integrated circuit chip;
• at least one solder bump formed on the at least one bump interface to provide a solder bump depopulated portion of the integrated circuit chip;
• a reinforcement layer disposed on the adhesion interface and proximate to the at least one solder bump, where the reinforcement layer covers a portion of the at least one solder bump, and
• a portion of the at least one solder bump is exposed;
• and
• a flip-chip die attached to the integrated circuit chip, where an exposed portion of the at least one solder bump is a reflowable connection between the wafer-level package device and the printed circuit board, and where the reinforcement layer is disposed on the adhesion interface and proximate to the at least one solder bump and covers the flip-chip die.