Wiring board and method for manufacturing the same

A method for manufacturing a wiring board, comprising:

• forming a wiring structure comprising a second insulation layer, a plurality of second conductive patterns formed on the second insulation layer, and a plurality of second mounting pads connected to the second conductive patterns;
• accommodating the wiring structure in a first insulation layer such that the wiring structure is positioned in the first insulation layer;
• forming on the first insulation layer a plurality of first conductive patterns including a plurality of first mounting pads such that the plurality of first mounting pads is positioned to mount a first semiconductor element and a second semiconductor element on the first insulation layer;
• and
• forming a plurality of third mounting pads on the first insulation layer above the second mounting pads such that the plurality of third mounting pads is connected to the second mounting pads and positioned to mount the first semiconductor element and the second semiconductor element on the first insulation layer,
• wherein the forming of the third mounting pads includes forming the plurality of third mounting pads such that the third mounting pads includes a plurality of first pads shifted away from the second mounting pads in a horizontal direction perpendicular to a lamination direction and positioned to face a plurality of conductive pads of the first semiconductor element, respectively, and a plurality of second pads shifted away from the second mounting pads in the horizontal direction and positioned to face a plurality of conductive pads of the second semiconductor element, respectively.