Semiconductor device
AssigneeRohm Co., Ltd.
InventorsYuichi Nakao, Tadao Ohta
Life of this patent
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AssigneeRohm Co., Ltd.
InventorsYuichi Nakao, Tadao Ohta
Estimating the term…
A semiconductor device includes an interlayer insulating film; a wiring formed on the interlayer insulating film so as to protrude there from and made of a material having copper as a main component, the wiring having a thickness direction and having a cross sectional shape of an inverted trapezoid that becomes wider in width with distance away from the interlayer insulating film; and a passivation film formed so as to cover the wiring. The passivation film is made of a laminated film in which a first nitride film, an intermediate film, and a second nitride film are laminated in that order from the wiring side. The intermediate film is made of an insulating material differing from those of the first and second nitride films, and has a tapered portion having a cross sectional shape of a trapezoid that becomes narrower in width with distance away from the interlayer insulating film.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.