Dual row quad flat no-lead semiconductor package
AssigneeMarvell World Trade Ltd.
InventorsChenglin Liu, Sheng C. Liao, Shiann-Ming Liou
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Abstract
Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.
Claims18
A Quad Flat No-Lead package comprising:
- an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package;
- and
- an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package,
- wherein each of the inner peripheral leads has a substantially rectangular shape having four corners,
- wherein two of the four corners that are nearest the outer row of outer peripheral leads have a rounded shape corresponding to a predetermined radius of curvature,
- wherein each of the inner peripheral leads has a width in a direction parallel to a nearest edge of the bottom surface of the Quad Flat No-Lead package, and
- wherein the two rounded corners of the substantially rectangular shape are rounded with the predetermined radius of curvature equal to about half the width of each of the inner peripheral leads.
A Quad Flat No-Lead package comprising:
- an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package;
- and
- an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package,
- wherein each of the inner peripheral leads has a substantially rectangular shape having four corners,
- wherein two of the four corners that are nearest the outer row of outer peripheral leads have a rounded shape corresponding to a predetermined radius of curvature, and
- wherein individual outer peripheral leads of the outer peripheral leads are about equidistant from two nearest inner peripheral leads of the inner peripheral leads.
An integrated circuit package comprising:
- a Dual Row Quad Flat No-Lead package having a top surface and a bottom surface, wherein the bottom surface of the Dual Row Quad Flat No-Lead package includes (i) an outer row of outer peripheral leads disposed on an outer periphery of the bottom surface of the Dual Row Quad Flat No-Lead package and (ii) an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, wherein the substantially rectangular shape includes four corners, and wherein two of the four corners nearest the outer row of outer peripheral leads has a rounded shape corresponding to a predetermined radius of curvature;
- and
- a printed circuit board electrically connected to the bottom surface of the Dual Row Quad Flat No-Lead package,
- wherein each of the inner peripheral leads has a width in a direction parallel to a nearest edge of the bottom surface of the Dual Row Quad Flat No-Lead package, and
- wherein the two rounded corners of the substantially rectangular shape are rounded with the predetermined radius of curvature equal to about half the width of each of the inner peripheral leads.
Dependencies are inferred from the claim text.