Integrated circuits and methods of forming conductive lines and conductive pads therefor
AssigneeMicron Technology, Inc.
InventorRoger W Lindsay
Life of this patent
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Abstract
An integrated circuit includes circuitry, a first conductor coupled to the circuitry, a conductive pad coupled to the first conductor, and a second conductor coupled to the conductive pad. The second conductor would be floating but for its coupling to the conductive pad. The second conductor may be spaced apart from the first conductor by a distance that is substantially equal to a width of a merged spacer that was formed from a merging of single sidewall spacers over a conductive material from which the first and second conductors were formed.
Claims19
An integrated circuit, comprising:
- circuitry;
- a conductor coupled to the circuitry;
- a first conductive pad coupled to the conductor;
- a first conductive opened-loop structure coupled to the conductive pad, wherein the first conductive opened-loop structure would be floating but for its coupling to the first conductive pad, wherein the first conductive opened-loop structure comprises first and second portions connected together by a third portion of the first conductive opened-loop structure;
- and
- a second conductive opened-loop structure that would be floating but for its coupling to a second conductive pad, wherein the second conductive opened-loop structure comprises first and second portions connected together by a third portion of the second conductive opened-loop structure;
- wherein the first portion of the first conductive opened-loop structure is successively adjacent to the first portion of the second conductive opened-loop structure;
- and
- wherein the first portion of the first conductive opened-loop structure extends from the third portion of the first conductive opened-loop structure to between the first and second conductive pads in a same direction that the first portion of the second conductive opened-loop structure extends from the third portion of the second conductive opened-loop structure to between the first and second conductive pads.
An integrated circuit, comprising:
- circuitry;
- a first conductor coupled to the circuitry;
- a first conductive pad coupled to the first conductor;
- a first conductive opened-loop structure coupled to the first conductive pad, wherein the first conductive opened-loop structure would be floating but for its coupling to the first conductive pad, wherein the first conductive opened-loop structure comprises first and second portions connected together by a third portion of the first conductive opened-loop structure;
- a second conductor coupled to other circuitry;
- a second conductive pad coupled to the second conductor;
- and
- a second conductive opened-loop structure coupled to the second conductive pad, wherein the second conductive opened-loop structure would be floating but for its coupling to the second conductive pad, wherein the second conductive opened-loop structure comprises first and second portions connected together by a third portion of the second conductive opened-loop structure;
- wherein the first portion of the first conductive opened-loop structure is successively adjacent to the first portion of the second conductive opened-loop structure;
- and
- wherein the first portion of the first conductive opened-loop structure extends from the third portion of the first conductive opened-loop structure to between the first and second conductive pads in a same direction that the first portion of the second conductive opened-loop structure extends from the third portion of the second conductive opened-loop structure to between the first and second conductive pads.
An integrated circuit, comprising:
- circuitry;
- a first conductor coupled to the circuitry;
- a first conductive pad coupled to the first conductor;
- a first conductive opened-loop structure, wherein the first conductive opened-loop structure comprises first and second portions connected together by a third portion of the first conductive opened-loop structure, wherein the second portion of the first conductive opened-loop structure is coupled in direct physical contact with the first conductive pad, wherein the first conductive opened-loop structure would be floating but for its second portion being coupled in direct physical contact with the first conductive pad;
- a second conductor coupled to other circuitry;
- a second conductive pad coupled to the second conductor;
- and
- a second conductive opened-loop structure, wherein the second conductive opened-loop structure comprises first and second portions connected together by a third portion of the second conductive opened-loop structure, wherein the second portion of the second conductive opened-loop structure is coupled in direct physical contact with the second conductive pad, wherein the second conductive opened-loop structure would be floating but for its second portion being coupled in direct physical contact with the second conductive pad;
- wherein the first portion of the first conductive opened-loop structure is successively adjacent to the first portion of the second conductive opened-loop structure;
- and
- wherein the first portion of the first conductive opened-loop structure extends from the third portion of the first conductive opened-loop structure to between the first and second conductive pads in a same direction that the first portion of the second conductive opened-loop structure extends from the third portion of the second conductive opened-loop structure to between the first and second conductive pads.
Dependencies are inferred from the claim text.