Package with multiple I/O side-solderable terminals

A method for forming a semiconductor device in a leadless chip carrier (LCC) having a lead frame assembly having an array of lead frame sub-assemblies, each having a device die arranged thereon, the sub-assemblies having I/O terminals electrically connected to the device die, the I/O terminals mutually connected by a connection bar, and middle I/O terminal, located between two other I/O terminals, has an offset geometry, the method comprising:

• encapsulating the lead frame assembly and the I/O terminals in a molding compound;
• in a first direction in a series of parallel cuts, laser cutting the molding compound covering the I/O terminals, to a depth of the connection bar, exposing vertical surfaces of the I/O terminals and forming a recess surrounding each one of the I/O terminals, the offset geometry making space for the laser cutting so that vertical surface of the middle I/O terminal may be exposed;
• electroplating the I/O terminals to form plated vertical surfaces;
• performing an additional series of cuts, cutting in the first direction extending through the connection bars and the molding compound;
• and
• performing in a second direction in a series of parallel cuts, the second direction angled with respect to the first direction, the second series of cuts extending through the lead frame assembly and molding compound to singulate an individual device from the lead frame assembly.

A leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between, the leadless packaged semiconductor device comprising:

• a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon;
• at least five I/O terminals wherein each of said terminals comprise a respective metal side pad;
• and
• wherein the respective metal side pad is disposed in a recess such that the respective metal side pad is partially below a surface and remaining above the surface.