Silicon-glass hybrid interposer circuitry
AssigneeAltera Corporation
InventorMinghao Shen
Life of this patent
Estimating the term…
Abstract
An interposer is provided. The interposer includes a silicon substrate layer, a glass substrate layer, and at least one through interposer via. The silicon substrate layer is formed on top of the glass substrate layer. The interposer may also be known as a hybrid interposer because it includes two different types of substrate layers forming one interposer. The through interposer via is formed to go through the silicon substrate layer and the glass substrate layer. The interposer may be used for forming an integrated circuit package. The integrated circuit package includes multiple integrated circuits that are mounted on the interposer.
Claims20
An interposer, comprising:
- a semiconductor layer having first and second surfaces, wherein a plurality of interconnect routing layers is formed on the first surface of the semiconductor layer;
- a glass layer, wherein the semiconductor layer is interposed between the glass layer and the plurality of interconnect routing layers;
- a bump metallization conductor formed directly on the glass layer;
- and
- a bump formed directly on the bump metallization conductor.
An integrated circuit package, comprising:
- an integrated circuit;
- and
- a hybrid interposer, wherein the integrated circuit is mounted on the hybrid interposer, and wherein the hybrid interposer comprises:
- a silicon substrate;
- a glass substrate that includes sodium, wherein the silicon substrate is formed directly on the glass substrate;
- and
- a plurality of bumps formed below the glass substrate.
A method of manufacturing a hybrid interposer having a glass wafer, comprising:
- forming a silicon wafer on the glass wafer;
- forming a plurality of microbumps for the hybrid interposer;
- forming a plurality of flip-chip bumps for the hybrid interposer;
- and
- forming a through-interposer via that is partly formed through the silicon wafer and partly formed through the glass wafer, wherein forming the through-interposer via further comprises:
- forming a first hole through only the silicon wafer.
Dependencies are inferred from the claim text.