Compliant pin fin heat sink and methods
AssigneeInternational Business Machines Corporation
InventorsJohn P. Karidis, Mark D. Schultz
Life of this patent
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Abstract
A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.
Claims16
A heat sink, comprising:
- a plurality of layers being disposed substantially parallel with a surface of a heat source, such layers including:
- a plurality of pin portions spaced apart from each other in a planar arrangement wherein each layer of pin portions in the planar arrangement is formed separate from adjacent layers of the heat sink and the pin portions of the layers are stacked and bonded to adjacent pin portions of the layers to form pin fins extending in a transverse direction relative to the heat source to sink heat such that the pin fins in the planar arrangement are free of interconnects between adjacent pin fins;
- and
- at least one compliant layer disposed between the pin fins and a mechanical load, the at least one compliant layer providing compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.
Dependencies are inferred from the claim text.