Electronic component package and method for manufacturing the same

A method for manufacturing an electronic component package,

• wherein a package precursor is provided, in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer,
• wherein a combination of a formation process of a plurality of metal plating layers and a patterning process of the metal plating layers is provided to form a step-like metal plating layer, the formation process being performed by sequential dry and wet plating processes with respect to the package precursor, the patterning process being performed by a patterning of at least two of the metal plating layers, and
• wherein the formation of the step-like metal plating layer comprises the steps of:
• (i)′ performing the dry plating process wholly with respect to a principal surface of the sealing resin layer to form a first metal plating layer, the electrode of the electronic component being exposed at the principal surface of the sealing resin layer;
• (ii)′ performing the wet plating process wholly with respect to a principal surface of the first metal plating layer to form a second metal plating layer;
• (iii)′ performing the dry or wet plating process wholly with respect to a principal surface of the second metal plating layer to form a third metal plating layer;
• (iv)′ subjecting the third metal plating layer to the patterning process to form a metal plating pattern layer “A′” configured to locally expose the second metal plating layer;
• (v)′ performing the wet plating process wholly with respect to the metal plating pattern layer “A′” and a locally exposed portion of the second metal plating layer to form a fourth metal plating layer;
• (vi)′ subjecting the fourth metal plating layer to the patterning process to form a metal plating pattern layer “B” configured to locally expose the first and third metal plating layers;
• and
• (vii)′ removing an exposed portion of the first and third metal plating layers.

An electronic component package, comprising:

• a sealing resin layer;
• an electronic component buried in the sealing resin layer;
• and
• a step-like metal plating pattern layer in electrical connection with the electronic component,
• wherein the step-like metal plating pattern layer is composed of an inside plating pattern and an outside plating pattern, the inside plating pattern being located relatively inside, and the outside plating pattern being located relatively outside,
• wherein a step-like form of the metal plating pattern layer is due to an exposure of the inside plating pattern from the outside plating pattern,
• wherein the inside plating pattern is composed of first and second metal plating layers, and the outside plating pattern is composed of third and fourth metal plating layers, and thereby the step-like metal plating pattern layer has a four-layered structure as a whole, and
• wherein each of the first and third metal plating layers has a thickness of 100 nm to 1000 nm, the second metal plating layer has a thickness of 5 μm to 20 μm, and the fourth metal plating layer has a thickness of 14 μm to 500 μm.