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US 9,425,121 B2Granted
Integrated fan-out structure with guiding trenches in buffer layer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin
Life of this patent
Estimating the term…
Abstract
A bottom package includes a molding compound, a buffer layer over and contacting the molding compound, and a through-via penetrating through the molding compound. A device die is molded in the molding compound. A guiding trench extends from a top surface of the buffer layer into the buffer layer, wherein the guiding trench is misaligned with the device die.
Claims20
A package comprising:
- a bottom package comprising:
- a molding compound;
- a buffer layer over and contacting the molding compound;
- a through-via penetrating through the molding compound;
- a device die molded in the molding compound;
- and
- a guiding trench extending from a top surface of the buffer layer into the buffer layer, wherein the guiding trench is misaligned with the device die;
- a top package over and bonded to the bottom package, wherein the top package and the bottom package have a gap therebetween;
- and
- an underfill filling outer portions of the gap, wherein the underfill extends into the guiding trench, and wherein a center portion of the gap is free from the underfill.
7 more elements
A package comprising:
- a bottom package comprising:
- a molding compound comprising a planar top surface and a planar bottom surface;
- a device die molded in the molding compound;
- a planar dielectric layer over and contacting the planar top surface of the molding compound;
- a through-via penetrating through the molding compound;
- and
- a first guiding trench in the planar dielectric layer;
- a top package bonded to the bottom package, wherein the top package is spaced apart from the bottom package by a gap, and wherein the first guiding trench is connected to the gap;
- and
- an underfill filling a perimeter of the gap and at least a portion of the first guiding trench, and wherein a center portion of the gap is encircled by the underfill, and wherein the center portion of the gap forms an empty space.
7 more elements
A package comprising:
- a bottom package comprising:
- an encapsulating material;
- a device die encapsulated in the encapsulating material;
- at least one dielectric layer over and contacting a top surface of the encapsulating material;
- and
- a first guiding trench in the at least one dielectric layer, wherein the first guiding trench encircles a region directly over the device die;
- a top package over and bonded to the bottom package;
- and
- an underfill between the bottom package and the top package, wherein the underfill fills the first guiding trench, and the region directly over the device die forms and air gap encircled by the underfill.
6 more elements
Dependencies are inferred from the claim text.